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| ICX084AK Diagonal 6mm (Type 1/3) Progressive Scan CCD Image Sensor with Square Pixel for Color Cameras Description The ICX084AK is a diagonal 6mm (Type 1/3) interline CCD solid-state image sensor with a square pixel array which supports VGA format. Progressive scan allows all pixels signals to be output independently within approximately 1/30 second. This chip features an electronic shutter with variable charge-storage time which makes it possible to realize full-frame still image without a mechanical shutter. High resolution and high color reproductivity are achieved through the use of R, G, B primary color mosaic filters. Further, high sensitivity and low dark current are achieved through the adoption of HAD (Hole-Accumulation Diode) sensors. This chip is suitable for applications such as electronic still cameras, PC input cameras, etc. Features * Progressive scan allows individual readout of the image signals from all pixels. * High vertical resolution (480TV-lines) still image without a mechanical shutter. * Square pixel unit cell * Supports VGA format * Horizontal drive frequency: 12.27MHz * No voltage adjustments (reset gate and substrate bias are not adjusted.) * R, G, B primary color mosaic filters on chip * High resolution, high color reproductivity, high sensitivity, low dark current * Continuous variable-speed shutter 1/30 (typ.) to 1/10000s * Low smear * Excellent antiblooming characteristics * Horizontal register: 5V drive * 16-pin high precision plastic package (enables dualsurface standard) Device Structure * Interline CCD image sensor * Image size: * Number of effective pixels: * Total number of pixels: * Chip size: * Unit cell size: * Optical black: * Number of dummy bits: * Substrate material: 16 pin DIP (Plastic) Pin 1 2 V 8 2 Pin 9 H 31 Optical black position (Top View) Diagonal 6mm (Type 1/3) 659 (H) x 494 (V) approx. 330K pixels 692 (H) x 504 (V) approx. 350K pixels 5.84mm (H) x 4.94mm (V) 7.4m (H) x 7.4m (V) Horizontal (H) direction: Front 2 pixels, rear 31 pixels Vertical (V) direction: Front 8 pixels, rear 2 pixels Horizontal 16 Vertical 5 Silicon Wfine CCD is a registered trademark of Sony Corporation. Represents a CCD adopting progressive scan, primary color filter and square pixel. Sony reserves the right to change products and specifications without prior notice. This information does not convey any license by any implication or otherwise under any patents or other right. Application circuits shown, if any, are typical examples illustrating the operation of the devices. Sony cannot assume responsibility for any problems arising out of the use of these circuits. -1- E95101E99 ICX084AK Block Diagram and Pin Configuration (Top View) VOUT GND CGG GND V1 V2 2 B G B G B G 8 7 6 5 4 3 G B G B G B G G R G R G R Vertical register R G R G R Note) Horizontal register Note) 9 10 11 12 13 14 15 16 : Photo sensor SUBCIR GND VDD H1 VL SUB Pin Description Pin No. 1 2 3 4 5 6 7 8 Symbol V3 V2 V1 NC GND CGG GND VOUT GND Output amplifier gate1 GND Signal output Description Pin No. 9 10 11 12 13 14 15 16 Symbol VDD H2 RG V3 1 NC Description Vertical register transfer clock Vertical register transfer clock Vertical register transfer clock Supply voltage Supply voltage for the substrate SUBCIR voltage generation GND SUB VL RG H1 H2 GND Substrate clock Protective transistor bias Reset gate clock Horizontal register transfer clock Horizontal register transfer clock 1 DC bias is applied within the CCD, so that this pin should be grounded externally through a capacitance of 1000pF or more. Absolute Maximum Ratings Item Substrate clock SUB - GND Supply voltage VDD, VOUT, CGG, SUBCIR - GND VDD, VOUT, CGG, SUBCIR - SUB V1, V2, V3 - GND V1, V2, V3 - SUB Ratings -0.3 to +36 -0.3 to +18 -22 to +9 -15 to +16 to +10 to +15 to +16 -16 to +16 -10 to +15 -55 to +10 -65 to +0.3 -0.3 to +27.5 -0.3 to +20.5 -0.3 to +17.5 -30 to +80 -10 to +60 -2- Unit V V V V V V V V V V V V V V C C 2 Remarks Clock input voltage Voltage difference between vertical clock input pins Voltage difference between horizontal clock input pins H1, H2 - V3 H1, H2 - GND H1, H2 - SUB VL - SUB V2, V3 - VL RG - GND V1, H1, H2, GND - VL Storage temperature Operating temperature 2 +24V (Max.) when clock width < 10s, clock duty factor < 0.1%. ICX084AK Bias Conditions Item Supply voltage Protective transistor bias Substrate clock Symbol VDD VL SUB Min. 14.55 Typ. 15.0 1 2 Max. 15.45 Unit Remarks V 1 VL setting is the VVL voltage of the vertical transfer clock waveform, or the same power supply as the VL power supply for the V driver should be used. 2 Set SUBCIR pin to open when applying a DC bias to the substrate clock pin. DC Characteristics Item Supply current Symbol IDD Min. Typ. 6 Max. 8 Unit mA Remarks Clock Voltage Conditions Item Readout clock voltage VVT VVH02 VVH1, VVH2, VVH3 VVL1, VVL2, VVL3 Vertical transfer clock voltage V1, V2, V3 I VVL1 - VVL3 I VVHH VVHL VVLH VVLL Horizontal transfer clock voltage VH VHL VRG Reset gate clock voltage VRGLH - VRGLL VRGH Substrate clock voltage VSUB VDD +0.4 21.5 VDD +0.6 22.5 4.75 -0.05 4.5 5.0 0 5.0 Symbol Min. 14.55 -0.05 -0.2 -8.0 6.8 Typ. 15.0 0 0 -7.5 7.5 Max. 15.45 0.05 0.05 -7.0 8.05 0.1 1.0 2.3 1.0 1.0 5.25 0.05 5.5 0.8 VDD +0.8 23.5 Unit V V V V V V V V V V V V V V V V Waveform diagram 1 2 2 2 2 2 2 2 2 2 3 3 4 4 4 5 Input through 0.01F capacitance Low-level coupling High-level coupling High-level coupling Low-level coupling Low-level coupling VVL = (VVL1 + VVL3)/2 VVH = VVH02 Remarks -3- ICX084AK Clock Equivalent Circuit Constant Item Capacitance between vertical transfer clock and GND Symbol CV1 CV2 CV3 CV12 Capacitance between vertical transfer clocks CV23 CV31 Capacitance between horizontal transfer CH1, CH2 clock and GND Capacitance between horizontal transfer CHH clocks Capacitance between reset gate clock and GND Capacitance between substrate clock and GND Vertical transfer clock series resistor Vertical transfer clock ground resistor Horizontal transfer clock series resistor Reset gate clock series resistor V1 R1 R2 Min. Typ. 560 470 1500 1500 1500 1000 43 39 5 570 20 56 43 10 39 Max. Unit pF pF pF pF pF pF pF pF pF pF Remarks CRG CSUB R1, R2 R3 RGND RH1, RH2 RRG V2 CV12 CV1 RGND Cv31 CV3 CV2 RH1 H1 CHH Cv23 CH1 RH2 H2 CH2 R3 V3 Vertical transfer clock equivalent circuit Horizontal transfer clock equivalent circuit RRG RG CRG Reset gate clock equivalent circuit -4- ICX084AK Drive Clock Waveform Conditions (1) Readout clock waveform VT 100% 90% II II M VVT 10% 0% tr twh tf 0V M 2 Note) Readout clock is used by composing vertical transfer clocks V2 and V3. (2) Vertical transfer clock waveform V1 VVHL VVH1 VVHH VVH VVLH VVL01 VVL1 VVLL V2 VVH02 VVHH VVHL VVH2 VVH VVL VVLH VVL2 VVLL V3 VVHL VVH3 VVHH VVH VVL VVL03 VVLL VVLH VVL VVH = VVH02 VVL = (VVL01 + VVL03)/2 VVL3 = VVL03 VV1 = VVH1 - VVL01 VV2 = VVH02 - VVL2 VV3 = VVH3 - VVL03 -5- ICX084AK (3) Horizontal transfer clock waveform H1, H2 tr twh tf 90% VH 10% VHL twl (4) Reset gate clock waveform RG tr twh tf VRGH twl RG waveform Point A VRG VRGL + 0.5V VRGLH VRGL VRGLL H1 waveform 2.5V VRGLH is the maximum value and VRGLL is the minimum value of the coupling waveform during the period from Point A in the above diagram until the rising edge of RG. In addition, VRGL is the average value of VRGLH and VRGLL. VRGL = (VRGLH + VRGLL)/2 Assuming VRGH is the minimum value during the interval twh, then: VRG = VRGH - VRGL (5) Substrate clock waveform SUB 100% 90% M VSUB 10% VSUB 0% (A bias generated within the CCD) M 2 tf tr twh -6- ICX084AK Clock Switching Characteristics Item Readout clock Vertical transfer clock Horizontal transfer clock Symbol VT V1, V2, V3 H1 H2 twh twl tr tf Min. Typ. Max. Min. Typ. Max. Min. Typ. Max. Min. Typ. Max. 2.3 2.5 0.5 15 24 30 25 31.5 25 30 10 17.5 10 0.01 0.01 11 13 62.5 3 0.5 15 0.5 350 10 17.5 10 0.01 0.01 3 0.5 15 Unit s ns ns Remarks During readout 1 2 During imaging 26.5 31.5 During parallel- H1 serial conversion H2 RG SUB s ns s During drain charge Reset gate clock Substrate clock 1.5 1.8 1 When vertical transfer clock driver CXD1267AN is used. 2 tf tr - 2ns, and the cross-point voltage (VCR) for the H1 rising side of the H1 and H2 waveforms must be at least 2.5V. Item Symbol two Min. Typ. Max. Unit ns Remarks 3 Horizontal transfer clock H1, H2 21.5 25.5 3 The overlap period for twh and twl of horizontal transfer clocks H1 and H2 is two. -7- ICX084AK Image Sensor Characteristics Item G sensitivity Sensitivity comparison Saturation signal Smear Video signal shading Uniformity between video signal channels Dark signal Dark signal shading Line crawl G Line crawl R Line crawl B Lag R B Symbol Sg Rr Rb Vsat Sm SHg Srg Sbg Vdt Vdt Lcg Lcr Lcb Lag Min. 300 0.3 0.4 500 0.005 0.015 20 25 8 8 4 1 3.8 3.8 3.8 0.5 Typ. 450 0.45 0.55 0.6 0.7 mV % % % % % mV mV % % % % Max. Unit mV Measurement method 1 1 1 2 3 4 4 5 5 6 7 8 8 8 9 (Ta = 25C) Remarks Ta = 60C Zone 0 and I Zone 0 to II' Ta = 60C Ta = 60C Zone Definition of Video Signal Shading 659 (H) 12 12 12 H 8 V 10 H 8 494 (V) Zone 0, I Zone II, II' V 10 10 Ignored region Effective pixel region Measurement System CCD signal output [A] Gr/Gb CCD C.D.S AMP S/H R/B Gr/Gb channel signal output [B] S/H R/B channel signal output [C] Note) Adjust the amplifier gain so that the gain between [A] and [B], and between [A] and [C] equals 1. -8- ICX084AK Image Sensor Characteristics Measurement Method Measurement conditions 1) In the following measurements, the device drive conditions are at the typical values of the bias and clock voltage conditions. 2) In the following measurements, spot blemishes are excluded and, unless otherwise specified, the optical black level (OB) is used as the reference for the signal output, which is taken as the value of the Gr/Gb signal output or the R/B signal output of the measurement system. Color coding and readout of this image sensor Gb R Gb R B Gr B Gr Gb R Gb R B Gr B Gr The primary color filters of this image sensor are arranged in the layout shown in the figure on the left (Bayer arrangement). Gr and Gb denote the G signals on the same line as the R signal and the B signal, respectively. Horizontal register Color Coding Diagram All pixels signals are output successively in a 1/30s period. The R signal and Gr signal lines and the Gb signal and B signal lines are output successively. -9- ICX084AK Definition of standard imaging conditions 1) Standard imaging condition I : Use a pattern box (luminance 706cd/m2, color temperature of 3200K halogen source ) as a subject. (Pattern for evaluation is not applicable.) Use a testing standard lens with CM500S (t = 1.0mm) as an IR cut filter and image at F5.6. The luminous intensity to the sensor receiving surface at this point is defined as the standard sensitivity testing luminous intensity. 2) Standard imaging condition II : Image a light source (color temperature of 3200K) with a uniformity of brightness within 2% at all angles. Use a testing standard lens with CM500S (t = 1.0mm) as an IR cut filter. The luminous intensity is adjusted to the value indicated in each testing item by the lens diaphragm. 1. G sensitivity, sensitivity comparison Set to standard imaging condition I. After selecting the electronic shutter mode with a shutter speed of 1/100s, measure the signal outputs (VGr, VGb, VR and VB) at the center of each Gr, Gb, R and B channel screens, and substitute the values into the following formula. VG = (VGr + VGb)/2 Sg = VG x 100 [mV] 30 Rr = VR/VG Rb = VB/VG 2. Saturation signal Set to standard imaging condition II. After adjusting the luminous intensity to 20 times the intensity with the average value of the Gr signal output, 150mV, measure the minimum values of the Gr, Gb, R and B signal outputs. 3. Smear Set to standard imaging condition II. With the lens diaphragm at F5.6 to F8, first adjust the average value of the Gr signal output to 150mV. Measure the average values of the Gr signal output, Gb signal output, R signal output and B signal output (Gra, Gba, Ra and Ba), and then adjust the luminous intensity to 500 times the intensity with average value of the Gr signal output, 150mV. After the readout clock is stopped and the charge drain is executed by the electronic shutter at the respective H blankings, measure the maximum value (VSm [mV]), independent of the Gr, Gb, R and B signal outputs, and substitute the values into the following formula. Sm = VSm / Gra + Gba + Ra + Ba 1 1 x x x 100 [%] (1/10V method conversion value) 4 500 10 4. Video signal shading Set to standard imaging condition II. With the lens diaphragm at F5.6 to F8, adjust the luminous intensity so that the average value of the Gr signal output is 150mV. Then measure the maximum (Grmax [mV]) and minimum (Grmin [mV]) values of the Gr signal output and substitute the values into the following formula. SHg = (Grmax - Grmin)/150 x 100 [%] - 10 - ICX084AK 5. Uniformity between video signal channels After measuring 4, measure the maximum (Rmax [mV]) and minimum (Rmin [mV]) values of the R signal and the maximum (Bmax [mV]) and minimum (Bmin [mV]) values of the B signal, and substitute the values into the following formula. Srg = (Rmax - Rmin)/150 x 100 [%] Sbg = (Bmax - Bmin)/150 x 100 [%] 6. Dark signal Measure the average value of the signal output (Vdt [mV]) with the device ambient temperature 60C and the device in the light-obstructed state, using the horizontal idle transfer level as a reference. 7. Dark signal shading After measuring 6, measure the maximum (Vdmax [mV]) and minimum (Vdmin [mV]) values of the dark signal output and substitute the values into the following formula. Vdt = Vdmax - Vdmin [mV] 8. Line crawl Set to standard imaging condition II. Adjust the luminous intensity so that the average value of the Gr signal output is 150mV, and then insert R, G, and B filters and measure the difference between G signal lines (Glr, Glg, Glb [mV]) as well as the average value of the G signal output (Gar, Gag, Gab). Substitute the values into the following formula. Lci = Gli x 100 [%] (i = r, g, b) Gai 9. Lag Adjust the Gr signal output value generated by strobe light to 150mV. After setting the strobe light so that it strobes with the following timing, measure the residual signal (Vlag). Substitute the value into the following formula. Lag = (Vlag/150) x 100 [%] VD V2 Light Strobe light timing Gr signal output 150mV Output Vlag (Lag) - 11 - Drive Circuit 15V 1 19 18 17 16 15 14 13 22/16V 1000p 1/35V 0.1 3.3/16V 20 100k 2 3 XSUB 4 XV1 5 -7.5V XV2 6 CXD1267AN 7 XSG 8 12 11 XV3 9 10 V3 V2 V1 NC CGG GND GND VOUT H2 H1 RG VL SUB GND SUBCIR H2 16 15 14 13 12 11 10 9 2200p 1M H1 1/20V 100k VDD - 12 - 1 2 3 4 5 6 0.01 22/20V 7 8 100 CCD OUT 3.9k ICX084 ( BOTTOM VIEW ) 2SK523 0.01 3.3/20V RG ICX084AK ICX084AK Spectral Sensitivity Characteristics (Includes lens characteristics, excludes light source characteristics) 1 0.9 R 0.8 B 0.7 G Relative Response 0.6 0.5 0.4 0.3 0.2 0.1 0 400 500 Wave Length [nm] 600 700 Sensor Readout Clock Timing Chart XSG XV1 XV2 XV3 Sensor readout clock XSG is used by composing XV2 and XV3. HD 42.4s (520 bits) V1 V2 V3 2.53s (31 bits) 2.04s (25 bits) - 13 - Drive Timing Chart (Vertical Sync) VD HD 7 14 15 525 1 508 510 V1 V2 V3 12 34 56 78 12 34 494 12 3 CCD OUT 525 1 7 - 14 - ICX084AK Drive Timing Chart (Horizontal Sync) HD/SYNC 78 1 BLK 35 107 123 780 1 CLK 35 1 72 1 16 1 RG SHP SHD 1 36 1 1 1 1 36 1 1 24 36 1 12 12 36 24 V1 V2 V3 H1 23 1 12 H2 1 1 37 SUB 1 125 132 - 15 - ICX084AK ICX084AK Notes on Handling 1) Static charge prevention CCD image sensors are easily damaged by static discharge. Before handling be sure to take the following protective measures. a) Either handle bare handed or use non-chargeable gloves, clothes or material. Also use conductive shoes. b) When handling directly use an earth band. c) Install a conductive mat on the floor or working table to prevent the generation of static electricity. d) Ionized air is recommended for discharge when handling CCD image sensor. e) For the shipment of mounted substrates, use boxes treated for the prevention of static charges. 2) Soldering a) Make sure the package temperature does not exceed 80C. b) Solder dipping in a mounting furnace causes damage to the glass and other defects. Use a ground 30W soldering iron and solder each pin in less than 2 seconds. For repairs and remount, cool sufficiently. c) To dismount an image sensor, do not use a solder suction equipment. When using an electric desoldering tool, use a thermal controller of the zero cross On/Off type and connect it to ground. 3) Dust and dirt protection Image sensors are packed and delivered by taking care of protecting its glass plates from harmful dust and dirt. Clean glass plates with the following operation as required, and use them. a) Perform all assembly operations in a clean room (class 1000 or less). b) Do not either touch glass plates by hand or have any object come in contact with glass surfaces. Should dirt stick to a glass surface, blow it off with an air blower. (For dirt stuck through static electricity ionized air is recommended.) c) Clean with a cotton bud and ethyl alcohol if the grease stained. Be careful not to scratch the glass. d) Keep in a case to protect from dust and dirt. To prevent dew condensation, preheat or precool when moving to a room with great temperature differences. e) When a protective tape is applied before shipping, just before use remove the tape applied for electrostatic protection. Do not reuse the tape. 4) Installing (attaching) a) Remain within the following limits when applying a static load to the package. Do not apply any load more than 0.7mm inside the outer perimeter of the glass portion, and do not apply any load or impact to limited portions. (This may cause cracks in the package.) Cover glass 50N Plastic package Compressive strength 50N 1.2Nm Torsional strength b) If a load is applied to the entire surface by a hard component, bending stress may be generated and the package may fracture, etc., depending on the flatness of the bottom of the package. Therefore, for installation, use either an elastic load, such as a spring plate, or an adhesive. - 16 - ICX084AK c) The adhesive may cause the marking on the rear surface to disappear, especially in case the regulated voltage value is indicated on the rear surface. Therefore, the adhesive should not be applied to this area, and indicated values should be transferred to the other locations as a precaution. d) The notch of the package is used for directional index, and that can not be used for reference of fixing. In addition, the cover glass and seal resin may overlap with the notch of the package. e) If the lead bend repeatedly and the metal, etc., clash or rub against the package, the dust may be generated by the fragments of resin. f) Acrylate anaerobic adhesives are generally used to attach CCD image sensors. In addition, cyanoacrylate instantaneous adhesives are sometimes used jointly with acrylate anaerobic adhesives. (reference) 5) Others a) Do not expose to strong light (sun rays) for long periods, color filters will be discolored. When high luminance objects are imaged with the exposure level control by electronic-iris, the luminance of the image-plane may become excessive and discolor of the color filter will possibly be accelerated. In such a case, it is advisable that taking-lens with the automatic-iris and closing of the shutter during the power-off mode should be properly arranged. For continuous using under cruel condition exceeding the normal using condition, consult our company. b) Exposure to high temperature or humidity will affect the characteristics. Accordingly avoid storage or usage in such conditions. c) The brown stain may be seen on the bottom or side of the package. But this does not affect the CCD characteristics. - 17 - Package Outline Unit: mm 16pin DIP (450mil) A 0 to 9 6.1 9 16 D ~ 2.5 C 11.43 8.4 5.7 V 2-R0.5 ~ 2.5 H 9.5 11.4 0.1 0.5 B' 3.1 0.3 M 1.27 3.5 0.3 - 18 - 1.2 2.5 1. "A" is the center of the effective image area. 3.35 0.15 9.2 ~ 2. The two points "B" of the package are the horizontal reference. The point "B'" of the package is the vertical reference. 3. The bottom "C" of the package, and the top of the cover glass "D" are the height reference. 4. The center of the effective image area relative to "B" and "B'" is (H, V) = (6.1, 5.7) 0.15mm. 5. The rotation angle of the effective image area relative to H and V is 1. 6. The height from the bottom "C" to the effective image area is 1.41 0.10mm. The height from the top of the cover glass "D" to the effective image area is 1.94 0.15mm. 7. The tilt of the effective image area relative to the bottom "C" is less than 50m. The tilt of the effective image area relative to the top "D" of the cover glass is less than 50m. 8. The thickness of the cover glass is 0.75mm, and the refractive index is 1.5. 9. The notches on the bottom of the package are used only for directional index, they must not be used for reference of fixing. 0.69 0.46 0.3 (For the first pin only) 1.27 PACKAGE STRUCTURE PACKAGE MATERIAL Plastic LEAD TREATMENT GOLD PLATING LEAD MATERIAL 42 ALLOY ICX084AK PACKAGE WEIGHT 0.9g 0.25 1.2 11.6 10.3 12.2 0.1 8 1 2.5 B |
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